Connection status: XHCI:HUB3[#8]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8843-5286
Boot version: 1.05, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x11 (Toshiba)
Product name: 008GB0 (0x303038474230), rev: 0x00, serial number: 0xCD2BAC74
Manufacturing date: фев 2020
CID: 11010030 30384742 3000CD2B AC742714
CSD: D0270032 8F5903FF FFFFFFE7 864000A6
Firmware version: 0x3
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 4 MiB [Provisioned, counter: 53852]
User area: 7.28 GiB(7,818,182,656 bytes)
Cache size: 4 MiB
Secure Write Protect Information: 0x01
Secure Feature support: 0x55
Partition configuration: 0x00
No boot acknowledge is sent (default)
Device is not boot-enabled (default)
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
eMMC selected: [TOSHIBA] THGBMJG6C1LBAIL/8GB (BGA153)